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origin modeling and suppression of grinding marks in ultra precision grinding of silicon wafers

Two-dimensional extreme distribution for estimating ...

Abstract: The effective estimation of the operational reliability of mechanism is a significant challenge in engineering practices, especially when the variance of uncertain factors becomes large. Addressing this challenge, a novel mechanism reliability method via a two-dimensional extreme distribution is …

---- Origin, modeling …

: A phenomenon commonly encountered in grinding of silicon wafers is the grinding marks, which are difficult to remove by subsequent polishing process, and have been a great obstacle to the manufacture of silicon wafers with higher flatness. In this paper, the grinding marks formation mechanism was clarified, a grinding marks formation ...

Tribology of Abrasive Machining Processes | Marinescu, W ...

Newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing can be better understood as tribological processes. Understanding the tribological principles of abrasive processes is crucial to discovering improvements in accuracy, production rate, and surface quality of products spanning all industries, from machine parts ...

Transactions of the JSME (in Japanese)

This phenomenon, which is typical in turbomachinery, is referred to as ice shedding. The ice shedding phenomenon is very complicated because there are several unknown physical properties of ice, such as the ice density, the adhesion force between accreted ice …

Origin, modeling and suppression of grinding marks in ...

Highlights Grinding marks on silicon wafers are caused by the axial run out of the cup wheel. Grinding marks present multiple angular wavelengths characteristics. A grinding marks formation model was developed. An angular wavelength model of the grinding marks was developed. Grinding marks can be suppressed by reducing the cutting paths aggregation.

AOMC

An analytical force model for ultra-precision diamond sculpturing of micro-grooves with textured surfaces. International Journal of Mechanical Sciences, 160, 129-139. 12. Sun, Z., To, S., & Yu, K. M. (2019). An investigation in the ultra-precision fly cutting of freeform surfaces on brittle materials with high machining efficiency and low tool ...

(PDF) Fracture and ductile vs. brittle behavior--Theory ...

Fracture and ductile vs. brittle behavior--Theory, modeling and experiment. 1999. Kyung-Suk Kim. Download Download PDF. Full PDF Package Download Full PDF Package. This Paper. A short summary of this paper. 37 Full PDFs related to this paper. Read Paper.

Wafer Grinding of Using Fixed Abrasive Diamond Wheel ...

The wafer grinding by use of fixed abrasive diamond wheels is required to create a high-quality wafer surface in a short time. In general, it is known that the grinding performance of diamond wheel is mainly dependent on grinding wheel specifications and grinding conditions. The cutting edge distribution or abrasive protrusion height in depth-wise of a specified wheel is one of the most ...

Eleventh International Conference on Information Optics ...

Ultra-precision grinding of transparent AlON optical window ... Design of high efficiency ITO phase/intensity modulator based on ultra-thin silicon strip waveguide ... Relative intensity noise suppression of intensity modulator and semiconductor optical amplifier Author(s): ...

[PDF] Fine grinding of silicon wafers: effects of chuck ...

Silicon wafers are used for production of most microchips. Various processes are needed to transfer a silicon ingot into wafers. With continuing shrinkage of feature sizes of microchips, more stringent requirement is imposed on wafer flatness. Fine grinding of silicon wafers is a patented technology to produce super flat wafers at a low cost.

Zhe Li - Associate Professor - Sun Yat-sen University ...

Origin, modeling and suppression of grinding marks in ultra-precision grinding of silicon wafers International Journal of Machine Tools and Manufacture Mar 2013 A phenomenon commonly encountered in grinding of silicon wafers is the grinding marks, which are difficult to remove by subsequent polishing process, and have been a great obstacle to ...

Abstract - OSA | OSA Publishing

High-precision optical components with complex shapes or microstructures have been extensively used in numerous fields such as biomedicine, energy and aerospace. In order to accurately achieve the specific functions of the components, the form accuracy and uniform surface quality need to reach an ever-high level. To achieve this, ultra-precision normal grinding is used for machining …

CIRP

Study of the effects of laser micro structuring on grinding of silicon nitride ceramics: Bahman Azarhoushang, Babak Soltani, Amir Daneshi / Goverdham D. Lahoti (1) STC G, 67/1/2018, P.329 : Keywords: Laser assisted grinding, Silicon nitride, Specific grinding energy, Ultra-short pulsed laser, Laser energy, Single grain cutting

KURODA HISTORY 90 | Kuroda Precision Industries Ltd.

Kuroda Precision Industries ltd. KURODA HISTORY 90 information. Kuroda Precision Industries is manufacturer of precision equipments and machines of Japan. We manufacture such as Precision Ball Screws,Ballscrew Actuators,Press Tools,Surface Grinding Machine,Gauges,Ultra Precision Surface Configuration Measuring systems and etc.

Fine grinding of silicon wafers: Designed experiments ...

Research related to wafer grinding marks could be retrieved to the 1990s, when Tonshoff et al. [14] firstly reported the grinding marks in grinding of silicon wafers, and argued that they are the ...

ELID Grinding | PDF | Grinding (Abrasive Cutting) | Machining

ULTRA-PRECISION GRINDING Suzuki and Murakami as developed an another ultra precision grinding machine for machining non-axisymmetric aspheric mirrors. This is a five-axis machine having a feedback resolution of 10 nm, and a laser rotary encoder with a resolution of 0.00002 degree, controls the rotational positioning.

ECSCRM Programme 2018 by Warwick School of Engineering - …

The Takatori single wafer Grinding system is designed for hard wafers such as SiC. ... Mark Ramm Modeling of Heat- and Mass-Transfer and Thermal Stress in …

Deformation and removal of semiconductor and laser single ...

Huo F W, Kang R K, Li Z and Guo D M 2013 Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers Int. J. Mach. Tool Manuf. 66 54–65 Crossref Google Scholar [158]

Micro-optics fabrication, packaging, and integration 29-30 ...

Micro-Optics Fabrication, Packaging, and Integration (2004

grinding marks silicon wafers - XIAMEN POWERWAY

Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers. A phenomenon commonly encountered in grinding of silicon wafers is the grinding marks, which are difficult to remove by subsequent polishing process, and have been a great obstacle to the manufacture of silicon wafers with higher flatness.

Curvature effect on surface topography and uniform scallop ...

High-precision optical components with complex shapes or microstructures have been extensively used in numerous fields such as biomedicine, energy and aerospace. In order to accurately achieve the specific functions of the components, the form accuracy and uniform surface quality need to reach an ever-high level. To achieve this, ultra-precision normal grinding is used for machining various ...

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19. D.M. Guo, F. Ren, Y.W. Sun. An approach to modeling cutting forces in five-axis ball-end milling of curved geometries based on tool motion analysis. ASME Transaction:Journal of Manufacturing Science and Engineering, 2010, 132(4): 041004-041004-8. ... D.M. Guo. Origin, modeling and suppression of grinding marks in ultra precision grinding ...

US8197303B2 - Sapphire substrates and methods of making ...

US8197303B2 US11/963,454 US96345407A US8197303B2 US 8197303 B2 US8197303 B2 US 8197303B2 US 96345407 A US96345407 A US 96345407A US 8197303 B2 US8197303 B2 US 8197303B2 Authority US United States Prior art keywords grinding abrasive sapphire vol less Prior art date Legal status (The legal status is an assumption and is not a legal conclusion.

Ultra-precision engineering in lithographic exposure ...

In this process, a large single crystal, the ingot, is grown out of molten silicon, starting with a small seed crystal. This ingot can have a diameter up to 300 mm, and thin wafers of approximately 0.7 mm thickness are cut from this ingot by means of very thin grinding discs. Silicon is a very brittle 'stone-like' material.

Chemical Mechanical Polishing of Silicon Wafers: Finite ...

Silicon is the primary semiconductor material used to fabricate integrated circuits. The quality of microchips depends directly on the quality of silicon wafers. A series of processes are required to manufacture the high-quality silicon wafers. Chemical mechanical polishing is a necessary step to achieve the required wafer flatness.

Origin, modeling and suppression of grinding marks in ...

Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers A phenomenon commonly encountered in grinding of silicon wafers is the grinding marks, which are difficult to remove by subsequent polishing process, and have been a great obstacle to the manufacture of silicon wafers with higher flatness.

2010--Ultra-precision-grinding_2010_CIRP-Annals ...

In single-side grinding, the wafer is vacuum chucked to a porous ceramic chuck. Both, the wheel and the wafer, usually rotate anti-clockwise which results in a superimposed cutting speed vc depending on the radial position on the wafer. Another method for ultra-precision grinding of silicon wafers is double-side grinding or double disk grinding.

International Journal of Machine Tools and Manufacture ...

A predictive model of grinding force in silicon wafer self-rotating grinding: M.W. Fu · J.L. Wang · A.M. Korsunsky · A.M. Korsunsky Relationship between temperature at cut front edge and kerf quality in fiber laser cutting of Al–Cu aluminum alloy: Mujian Xia · Dongdong Gu · Guanqun Yu · Donghua Dai · Hongyu Chen · Qimin Shi · Qimin Shi

Study into grinding force in back grinding of wafer with ...

Chidambaram S, Pei ZJ, Kassir S (2003) Fine grinding of silicon wafers: a mathematical model for grinding marks. Int J Mach Tools Manuf 43:1595–1602. Article Google Scholar 23. Huo FW, Kang RK, Li Z et al (2013) Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers.

The effect of the chuck shape on the wafer topography in ...

Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers. Int J Mach Tools Manuf 2013 ; 66: 54 – 65 . Google Scholar | Crossref

CIRP

Keywords: Ultra-precision, Finishing, X-ray optics : Abstract : Fabricating super-smooth aspheric optics for future hard X-ray telescopes will require a new process chain. Whilst diamond turning of electroless nickel plating can generate ~100 nm P-V aspheric molding dies, associated turning marks must be removed before replication.

Advances in Industrial Control | Microelectromechanical ...

Today, ultra-precision machine ... a mercury vapor lamp is shone through a mask containing the features of the chip and projected onto the surface of the silicon wafers in a ... Tape head machining Flying height testing 1.3.3 Optical Manufacturing Lens and mirror diamond turning machines Optical grinding machines Precision rotary ...

Micromachines | Free Full-Text | Suppression of Surface ...

The rotation speed ratio (RSR) is an important parameter influencing the surface waviness features in the parallel grinding process, which equals the ratio of the grinding wheel's rotation speed N g and the workpiece's rotation speed N w, as described in Equation (3) [].When RSR is integer, the peaks and valleys of the circular waviness profiles generated during all the revolutions of the ...

---- Origin, …

: A phenomenon commonly encountered in grinding of silicon wafers is the grinding marks, which are difficult to remove by subsequent polishing process, and have been a great obstacle to the manufacture of silicon wafers with higher flatness. In this paper, the grinding marks formation mechanism was clarified, a grinding marks formation ...

US9464365B2 - Sapphire substrate - Google Patents

US9464365B2 US14/174,602 US201414174602A US9464365B2 US 9464365 B2 US9464365 B2 US 9464365B2 US 201414174602 A US201414174602 A US 201414174602A US 9464365 B2 US9464365 B2 US 9464365B2 Authority US United States Prior art keywords normalized sapphire substrate abrasive grinding sapphire Prior art date Legal status (The legal status is an assumption and is …

Residual Stress Distribution in Silicon Wafers Machined by ...

Subsurface damage (SSD) and grinding damage-induced stress (GDIS) are a focus of attention in the study of grinding mechanisms. Our previous study proposed a load identification method and analyzed the GDIS in a silicon wafer ground (Zhou et al., 2016, "A Load Identification Method for the GDIS Distribution in Silicon Wafers," Int. J. Mach. Tools Manuf., 107, pp. 1–7.).

Wafer Thinning Process and Its Critical Manufacturability ...

to attain thinning wafer or silicon wafers an ultra-precision grinding machine [1] should carry it out. Nowadays, several issues and requirements are encountered during proliferation from development to the manufacturing phase. The paper will discuss the several key process requirements to attain stress-free wafer thinning

Origin, modeling and suppression of grinding marks in ...

Request PDF | On Mar 1, 2013, F.W. Huo and others published Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers | Find, read and cite all the research ...

International Journal of Machine Tools and Manufacture ...

select article Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers. ... modeling and suppression of grinding marks in ultra precision grinding of silicon wafers. F.W. Huo, R.K. Kang, Z. Li, D.M. Guo. Pages 54-65 Download PDF.

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